Defect inspection, verification and metrology for advanced IC substrates and panel-level packaging.
Inspection and Metrology
KLA’s portfolio of process control solutions for the PCB manufacturing environment includes both automated optical inspection (AOI) systems for advanced defect inspection and panel metrology systems for 3D and 2D measurements. The AOI systems allow PCB and IC substrate manufacturers to find, identify and classify defects on any kind of PCB, including complex applications like semi-additive processes (SAP/mSAP), high-density interconnect (HDI), any-layer and flip-chip structures. The multi-mode metrology systems enable a wide range of measurement applications for both test and inline panels. The resulting critical inspection and metrology information, augmented by artificial intelligence (AI) and machine learning (ML), allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Lumina™
Inspection and Metrology for Advanced IC Substrates and Panel-Level Packaging
The Lumina™ system provides innovative defect inspection and metrology for the advanced IC substrates (ICS) and panel RDL required to support complex packaging architectures, such as flip chip BGA (FC-BGA) including glass core, 2.5 and 3D heterogeneous integrations, as well as panel-level packaging (PLP). With Omnisphere™ illumination, enhanced area camera and Multi-Modality™ scanning capability, the Lumina system enables high-sensitivity capture of unique defect types. With Lumina’s EcoNet™ connectivity, verification stations are no longer required. EcoNet on-tool automated defect classification (ADC) builds on distinct metadata and multi-modality images and uses advance machine learning algorithms to allow on-the-fly actionable classification. As a result, AOI-to-AOS transitions are seamless, yields are higher and cycle times are shorter. Lumina’s metrology capabilities reveal hidden process variations on via and traces. The Lumina inspection solution supports a range of advanced ICS technologies with the finest line/space dimensions and varying panel materials, including glass core substrates and organic interposers.
Orbotech Ultra Dimension™
Automated Optical Inspection (AOI)
The Orbotech Ultra Dimension™ series of automated optical inspection systems is changing the AOI room workflow for advanced PCB production, including substrate-like PCBs (SLP), modified semi-additive process (mSAP), advanced high-density interconnect (HDI), advanced flex and IC substrates. Built to meet evolving requirements for higher quality, greater yield and lower total cost of ownership (TCO), the Orbotech Ultra Dimension series fully integrates best-in-class pattern inspection, laser via (LV) inspection, remote multi-image verification pro (RMIV Pro) and 2D metrology into a single system. Triple Vision™ technology integrates images from three channels into a single multicolor image, enabling operators to accurately differentiate between real and false defects in under one second. State-of-the-art algorithms in KLA’s Magic™ technology removes the need to use inspection masks that can cause defects to be missed.
Defect inspection for substrate-like PCBs (SLP), modified semi-additive processes (mSAP), advanced high-density interconnect (HDI), advanced flex and IC substrates
Orbotech Ultra Dimension 900
4-in-1 AOI system with ultra-fine pattern inspection down to 5μm line and space, and 20μm LV diameter.
Orbotech Ultra Dimension 800
4-in-1 AOI system with ultra-fine pattern inspection down to 10μm.
Orbotech Ultra Dimension 700
4-in-1 AOI system with ultra-fine pattern inspection down to 15μm.
Orbotech Ultra Dimension LV
3-in-1 AOI system that combines AOI, 2D laser via (LV) measurement and remote multi-image verification pro capabilities for LVs down to 30μm in diameter.
Orbotech Ultra Fusion™
Automated Optical Inspection (AOI)
The Orbotech Ultra Fusion™ series of automated optical inspection systems delivers leading-edge AOI performance for advanced IC substrate production. Featuring powerful Multi-Image™ technology, the systems achieve the highest levels of detection accuracy and operational efficiency required for successful production of today’s complex applications, such as semi-additive processes (SAP/mSAP), high-density interconnect (HDI), any-layer and flip-chip structures. Using unique wavelengths of light from different angles to perform inspections, the Orbotech Ultra Fusion systems reduce defect false alarms by up to 70% compared to conventional AOI systems and reveal details unseen by other systems.
Defect inspection for IC substrates, semi-additive processes (SAP/mSAP), high-density interconnect (HDI), any-layer and flip-chip structures
Orbotech Ultra Fusion 600P
AOI for the most advanced IC substrates down to 5μm.
Orbotech Ultra Fusion 300
AOI for IC substrate and advanced HDI production down to 10μm.
Orbotech Ultra Fusion 200
AOI for advanced IC substrate production down to 15μm.
Orbotech Fusion™
Automated Optical Inspection (AOI)
The Orbotech Fusion™ series of automated optical inspection systems use breakthrough Multi-Image™ technology to inspect panels multiple times in one scan for unparalleled detection accuracy and the lowest false alarm level. The Multi-Image technology reduces false alarms by up to 70% compared to conventional AOI. The systems perform inspections using different lights and different angles with a combination of red and blue color illumination channels to reveal details unseen by other systems. Designed for HDI and flex PCB applications, the series redefines PCB production efficiency, while achieving a low cost per scan.
Defect inspection for high-density interconnect (HDI) and flex PCB
Orbotech Fusion 22
AOI designed for a range of HDI applications down to 25µm.
Orbotech Fusion R2R
AOI with sensitivity down to 25µm designed for a range of high-end flexible PCB applications, supporting both roll-to-roll automation and sheet-by-sheet modes.
Orbotech Discovery™ II
Automated Optical Inspection (AOI)
The Orbotech Discovery™ II series of automated optical inspection systems delivers new AOI capabilities for greater operational efficiency. The systems ensure high defect detection and low false alarms using field-proven SIP™ technology, while providing full flexibility to handle today’s challenging high-density interconnect (HDI), flex PCB, multi-layer board (MLB) and quick turnaround (QTA) mass production requirements. KLA’s Smart Setup™ transforms the traditional AOI setup process to a single cycle with minimized process steps, creating greater efficiency and lower cost of operation.
Defect inspection for high-density interconnect (HDI), multi-layer board (MLB), quick turnaround (QTA) and flexible PCB
Orbotech Discovery II 9200
AOI designed for HDI, flex PCB and MLB mass production with detection resolution down to 25μm line and space.
Orbotech Discovery II 9000
AOI designed for HDI mass production with detection resolution down to 30μm line and space.
Orbotech Discovery II 8800
AOI designed for MLB mass production with detection resolution down to 30μm line and space.
Orbotech Discovery II 8200
AOI designed for MLB and QTA mass production with detection resolution down to 35μm line and space.
ICOS™ T890
Packaged IC and Singulated Substrate Inspection and Metrology Systems
The ICOS™ T890 component inspector provides high-performance, fully automated optical inspection of packaged integrated circuit (IC) components and singulated IC substrates. The system provides accurate and repeatable 3D metrology and high sensitivity advanced visual inspection (AVI) for 6-sided defect detection to determine final package quality for a wide range of device types and sizes. The ICOS T890 offers parallel operation of four independent inspection stations and a component sorting station, achieving high throughput, cost-effective component inspection.
Advanced packaging, IC substrates (ICS)
Component Outgoing Quality Control (OQC) for all package types (Thin Quad Flat Package (TQFP), Quad Flat Package (QFP), BGA, Chip Scale Package (CSP), Wafer-Level Package (WLP), QFN, Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…) and singulated IC substrates
Zeta™-6x0
Panel Metrology System for PCB and IC Substrates
The Zeta™-6x0 panel metrology system addresses 3D and 2D metrology requirements for PCB and IC substrate manufacturing. Based on a multi-mode approach to measurements, the Zeta-6x0 optical profiler system combines the capability of several tools into one compact platform, capable of measuring a variety of applications such as via and trace dimensions, bump dimensions, overlay, film thickness, roughness and panel warpage. Additionally, the system has an option to integrate a panel inspection module for macro defect inspection and full panel image acquisition. The Zeta-6x0 Series profiler measures both test and inline product panels, providing the data required to enable process feedback during development and to support process control for high volume manufacturing.
PCB, IC substrates
Process monitor, Outgoing Quality Control (OQC), Tool monitor
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