Continuous Improvement Program

A continuous improvement program (CIP) leverages unpatterned wafer defect inspection to identify the specific process tools causing defects. With a tool monitoring CIP in place, automotive fabs can set objective targets for reducing the process defects that affect reliability.

Surfscan^® Series

Drive to Zero Defect

With Zero Defect Screening, fabs monitor 100% of die on all wafers at the critical process steps. This requires an inspector that is fast, sensitive and can reliably identify which defects matter. With this method, die that may fail are removed from the supply chain at the fab, where cost is lowest. A high sensitivity inspection strategy can partner with screening techniques to enable discovery of yield-critical defects for faster characterization of new processes and additional defect reduction.

8 Series

C30x

Puma^™

I-PAT^®

Advanced Design Node Inflection

Automotive features such as machine vision and AI require advanced ICs. To attain higher yield and quality standards for advanced design node devices, fabs require discovery of all systematic defect sources and an “every defect matters” approach to improving baseline yield.

39xx Series and 29xx Series

Voyager^® Series

eSL10™

eDR7xxx™ Series

Enhanced IC Packaging and PCBs

Today’s advanced packaging technology relies on innovative process techniques to provide improved IC component performance and multi-function integration. To prevent defective devices from moving forward in the supply chain, screening and sorting are important quality control steps for packaged IC components, IC substrates and printed circuit boards (PCBs). Inspection and metrology systems capture critical defects and variations for the continuous improvement of packaging and PCB processes, reliability-related issues and device failure traceability.

Packaging Manufacturing

PCB Inspection and Metrology

Power Device Reliability

Implemented in a wide range of automotive subsystems, power devices require the same quality standards as other automotive ICs. Specialized equipment for SiC epitaxy and GaN-on-silicon processes, and inspection systems for SiC substrates help manufacturers of power devices achieve automotive defect standards.

Wafer Process Control

Specialty Semiconductor Etch Processes

Specialty Semiconductor Deposition Processes

Power Device Process Control

Certified & Remanufactured