Deposition

Deposition is the process of forming a thin layer of a material onto the surface of the wafer. There are many types of deposition processes employed in the semiconductor industry, used to deposit a wide range of materials such as metals or non-conducting dielectric layers to create the desired electronic microstructure or other coatings to change the surface characteristics (e.g. refractive index, corrosion resistance, mechanical stress, hydrophobicity, etc) of the devices on the wafer.

KLA offers physical vapor deposition (PVD), plasma enhanced chemical vapor deposition (PECVD) and molecular vapor deposition (MVD).

Product Category

SPTS Sigma® PVD

Physical Vapor Deposition Systems

Physical Vapor Deposition (PVD) is a thin-film process that produces coatings of conducting, semiconducting or insulating materials onto a wafer surface. There are different forms of PVD: sputtering, evaporation, ion-beam deposition. KLA offers products based on sputtering technology. In the sputtering process, a "target" provides the source material that is bombarded with ions from a plasma in the process chamber. Atoms of the source material are ejected or sputtered into the plasma where reactions may or may not take place (depending on the process gas mix) and then condense onto the wafer surface. The SPTS Sigma® PVD system supports wafer sizes from 100mm to 300mm, and the fxP cluster platform allows integration of different forms of pre-treatment and deposition technology, depending on the specific process requirements.

SPTS Delta™ PECVD

Plasma Enhanced Chemical Vapor Deposition Systems

Plasma Enhanced Chemical Vapor Deposition (PECVD) is a process which uses the energy within a plasma to accelerate chemical reactions at the wafer surface to produce thin films at temperatures below 400°C. Energetic ion bombardment during deposition can be used to tailor the films’ electrical and mechanical properties. The SPTS Delta™ PECVD systems are used for a wide range of applications within the RF, power, photonics and MEMS markets, particularly in applications where a low processing temperature is required. The Delta™ fxP cluster system offers a comprehensive library of processes for a wide range of dielectric films and with deposition temperatures from 80°C to 400°C. The system also offers single and multi-wafer preheat chamber options for de-gassing sensitive substrates and edge contact processing capability for wafer back side deposition.

SPTS Osprey® PECVD

Plasma Enhanced Chemical Vapor Deposition for Advanced Packaging

For advanced packaging applications, the SPTS Osprey® PECVD system offers low temperature deposition processes compatible with 300mm bonded substrates and mold. Osprey® PECVD produces high quality, production qualified dielectric films at deposition temperatures as low as 110°C SiN – SiO stacks can be deposited in the same PECVD chamber with high reliability electrical performance and stability over time. Film and stack stress can be tuned across a wide range and optimized chamber hardware enables the lowest within-wafer stress range over competing PECVD systems. Where required, single-wafer and multi-wafer degas options are available to heat outgassing substrates and improve deposited film quality. Optimized SiO, TEOS SiO, SiCN and other advanced dielectric films are available for hybrid bonding and inter-die gap-fill applications.

MVD100E

Molecular Vapor Deposition (MVD®) Systems for R&D

The MVD100E molecular vapor deposition system is KLA's designated tool for R&D or pilot manufacturing. The MVD process enables the growth of ultra-thin organic and inorganic films with higher yields and better cost efficiencies than traditional liquid deposition techniques. MVD® is finding increasing use in applications requiring moisture barriers, anticorrosion coatings, or release layers for imprinting. The MVD100E system is designed for high performance, flexibility and reliability for the most demanding applications. Corporate and academic research labs have called it their most versatile and reliable piece of equipment.

MVD300/300E

Molecular Vapor Deposition (MVD®) Systems for High-Volume Manufacturing

The MVD300® molecular vapor deposition system (and MVD300E system equipped with an EFEM for full automation) are designed for high performance, flexibility and reliability for the most demanding high volume manufacturing applications. The MVD process enables the growth of ultra-thin organic and inorganic films with higher yields and better cost efficiencies than traditional liquid deposition techniques. MVD can be used in a number of growing applications, including the deposition of anti-stiction and anti-corrosion films onto MEMS devices.

MVD4500

Molecular Vapor Deposition (MVD®) Systems for Panels and Large Substrates

The MVD4500 molecular vapor deposition system is our panel and large substrate tool for the MVD process. The MVD process enables the growth of ultra-thin organic and inorganic films for applications requiring moisture barriers, anticorrosion coatings or release layers for imprinting. The MVD4500 system is capable of handling multiple substrates with sizes up to 930 x 720 mm. and is the only batch process tool capable of performing ALD and MVD on substrates in this size range. The system is designed for high performance, flexibility and reliability for the most demanding high volume manufacturing applications.

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