Revolutionary Defect Discovery

As our first process control system with integrated AI, the eSL10™ e-beam patterned wafer defect inspector employs SMARTs™ deep learning algorithms that discriminate between extremely subtle defect signals and surrounding pattern and process noise. With AI, the eSL10 can adapt to evolving inspection requirements, isolating the defects most critical to leading-edge device performance.

eSL10

Reinvented Defect Classification

Inspection systems capture critical defects for reticles, wafers, packages and PCBs. Reviewing optical and e-beam defect images has traditionally involved human intervention to verify defect types. AI systems learn and adapt to quickly sort and classify defects with reduced errors and without slowing down production.

Defect Inspection and Review

Reticle Decision Center

Smart Manufacturing

The future of smart IC manufacturing will utilize the connectivity in the factory to drive automated optimization. AI systems can process massive data sets to gain insight into trends and potential excursions and use this knowledge to make decisions. To maintain quality, yield and productivity, full visibility of the manufacturing process can provide the traceability required to drive continuous improvements.

Improved reliability for automotive semiconductors with I-PAT^®