200mm & Large Design-Rule Nodes
Robust demand for more mobile, automotive and industrial IoT devices is driving a significant increase in production of chips on 200mm wafers utilizing large design-rule nodes. To satisfy this demand, many fabs are utilizing upgraded, recertified tools, originally introduced when these design nodes were cutting edge.
300mm & Advanced Nodes
Today’s electronics require the most advanced logic microprocessors, high capacity memory chips and leading edge packaging integration. Advanced logic, DRAM, NAND flash and other leading edge semiconductor devices destined for the Internet of Things are fabricated at advanced design nodes in 300mm fabs around the world.
Specialty Semiconductors & PCB
IoT’s smart devices in mobile, home, automotive, industrial, AR/VR and wearable applications, depend on high performance computing and fast communication between a host of sensors and the cloud. These sensors (including MEMS, thermal, optical and chemical, for example) and their associated systems, drive the continued demand for innovative process and process control solutions.
Specialty Semiconductor Etch Processes
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