39xx

Super Resolution Broadband Plasma Patterned Wafer Defect Inspection Systems

The 3935 and 3920 EP broadband plasma defect inspection systems support wafer-level defect discovery, yield learning and inline monitoring for ≤5nm logic and leading-edge memory design nodes. With a light source that produces super resolution deep ultraviolet (SR-DUV) wavelength bands, low noise sensors and advanced algorithms, the 3935 and 3920 EP provide high sensitivity capture of unique defect types. The 3935 also includes technologies that enable quick resolution of defect issues, including Setup 2.0 infrastructure for scalable enhancements to inspection recipe setup, and DualSENS™ linkage between the 3935 optical inspector and e-beam review systems for enhanced defect sensitivity on low contrast layers. The 3920 EP includes several memory-specific algorithm and binning innovations that support capture and monitoring of critical defects for 3D NAND and DRAM devices. With throughput that supports inline monitoring requirements, the 3935 and 3920 EP pair sensitivity with speed, enabling Discovery at the Speed of Light™, for reduction of the time required to deliver wafer-level data for complete characterization of process issues during development and high volume manufacturing.

29xx

Broadband Plasma Patterned Wafer Defect Inspection Systems

The 2965 and 2950 EP broadband plasma defect inspection systems provide advancements in optical defect inspection, enabling discovery of yield-critical defects on ≤5nm logic and leading-edge memory design nodes. Using enhanced broadband plasma illumination technologies, such as Super•Pixel™ mode and advanced detection algorithms, the 2965 and 2950 EP inspectors provide the sensitivity required to capture critical defects across a range of process layers, material types and process stacks. With a wavelength band that enables capture of critical nanosheet defects, the 2965 enables chip manufacturers to ramp and produce leading-edge chips with gate all around transistor architectures. The 2950 EP includes several hardware, algorithm and defect binning innovations that support defect discovery and monitoring for 3D NAND and DRAM devices. As the industry-standard for inline monitoring, the 2965 and 2950 EP pair sensitivity with optical wafer defect inspection speed, enabling Discovery at the Speed of Light™ – the combination of fast defect discovery and full characterization of defect issues at optimal cost of ownership.

C30x

Broadband Plasma Patterned Wafer Defect Inspection Systems

The C30x Series broadband plasma optical defect inspectors enable systematic defect discovery and latent reliability defect detection for chip manufacturing for the automotive, IoT, 5G, consumer electronics and industrial (military, aerospace, medical) markets. The C30x inspectors leverage a tunable broadband illumination source, advanced optics and a low noise sensor to capture critical defects across a range of process layers and device types. NanoPoint™ technology focuses inspection on pattern areas at high risk for reliability failures, delivering actionable defect data that helps reduce die underkill and overkill. Through discovery of systematic defects, the C30x inspectors help accelerate characterization and optimization of new processes, design nodes and devices during R&D. In production, the C30x systems’ high sensitivity at optical inspection speed enable inline monitoring for critical process layers, helping fabs avoid defect excursions that affect final chip quality. The C30x inspectors are built on an extendible, configurable platform, supporting both 200mm and 300mm wafer sizes.

Voyager^®

Laser Scanning Patterned Wafer Defect Inspection Systems

The Voyager^® 1035 laser scanning inspection system supports production ramp defect monitoring for advanced logic and memory chip manufacturing. The Voyager 1035 inspector with DefectWise^® deep learning algorithm, separates key DOI (Defects Of Interest) from pattern nuisance defects to improve the overall defect capture rate of the defects that matter, including unique, subtle defects. Industry-unique oblique illumination and new sensors with a 30% improvement in quantum efficiency produce higher throughput and better sensitivity for lower dose inspection of delicate photoresist layers in applications such as after develop inspection (ADI) and photo cell monitoring (PCM) for EUV lithography. The Voyager 1035 delivers high throughput and sensitivity combined with deep learning capability to capture critical defects in the litho cell and other modules of the fab allowing process issues to be identified and rectified rapidly.

Puma^™

Laser Scanning Patterned Wafer Defect Inspection Systems

The Puma^™ 9980 laser scanning inspection system incorporates multiple sensitivity and speed enhancements that enable capture of critical defects of interest (DOI) at throughputs required for high volume manufacturing for 1Xnm advanced logic and advanced DRAM and 3D NAND memory devices. Part of a portfolio of advanced wafer defect inspection and review tools, the Puma 9980 provides the highest throughput solution for production ramp monitoring by enhancing capture of defect types on advanced patterning layers. The Puma 9980 incorporates NanoPoint™ design-aware capability, which produces more actionable inspection results through increased defect sensitivity, improved systematic nuisance binning and tightened defect coordinate accuracy.

Want to learn more about the I-PAT^® automated, inline die screening solution for Puma 9980 and Puma 9850? Click here.

8 Series

High Productivity Patterned Wafer Broad Range Inspection Systems

The 8 Series patterned wafer inspection systems detect a wide variety of defect types at very high throughput for fast identification and resolution of production process issues. The 8 Series provides cost-effective defect monitoring for chip manufacturing using 150mm, 200mm or 300mm silicon, SiC, GaN, glass and other substrates, from initial product development through volume production. The latest generation 8935 inspector employs new optical technologies and DesignWise^® and FlexPoint™ precise area inspection techniques to capture critical defects that can cause chip failures. DefectWise^® AI technology enables fast, inline separation of defect types for improved defect discovery and binning. With these innovations, the 8935 supports high productivity capture of yield and reliability-related defects at a low nuisance rate, helping chip manufacturers accelerate delivery of their products—reliably and at lower cost. The 8 Series inspectors support defect monitoring during fabrication of a broad range of leading-edge and legacy node device types, including logic, memory, power devices, LED, photonics, RF devices and MEMS. The 8 Series systems also support quality control during production of AR/VR lenses and hard disk drive (HDD) manufacturing. 8 Series models are field upgradeable, providing a cost-effective means to extend inspection performance.

CIRCL™

All-Surface Wafer Defect Inspection, Metrology and Review Cluster System

The CIRCL™ cluster tool has four modules, covering all wafer surfaces and providing parallel data collection at high throughput for efficient process control. The modules comprising the latest-generation CIRCL5 system include: front side wafer defect inspection; wafer edge defect inspection, profile, metrology and review; backside wafer defect inspection and review; and, optical review and classification of front side defects. Data collection is controlled by DirectedSampling™, an innovative approach that uses results from one measurement to trigger other types of measurements within the cluster. The modular configuration of CIRCL5 offers flexibility for varying process control needs, saves overall fab space, reduces wafer queue time, and provides a cost-effective upgrade path to protect a fab's capital investment.

Castor™

High Productivity Patterned Wafer Inspection and Metrology System

The Castor™ patterned wafer inspection system is an all-in-one solution addressing yield-critical challenges for OLED on silicon (OLEDoS) manufacturing. The high productivity system offers defect inspection, review and 3D metrology in a single run. From anode layer deposition through thin-film encapsulation to cover glass, the high-sensitivity defect inspection with advanced classification supports quality control strategies throughout the manufacturing process. Process issues are quickly identified and resolved with fast, non-destructive height measurements of buried defects at the thin film encapsulation (TFE) process step. The Castor system provides inline monitoring for improved OLEDoS-based microdisplay yield, enabling ultra-high-resolution visuals for multiple near-eye display applications, including virtual reality (VR) and mixed reality (MR).

Surfscan^®

Unpatterned Wafer Defect Inspection Systems

The Surfscan^® SP7^XP unpatterned wafer inspection system identifies defects and surface quality issues that affect the performance and reliability of leading-edge logic and memory devices. It supports IC, OEM, materials and substrate manufacturing by qualifying and monitoring tools, processes and materials, including those used for EUV lithography. Using a DUV laser and optimized inspection modes, the Surfscan SP7^XP delivers ultimate sensitivity for advanced node R&D and the throughput to support high volume manufacturing. Complementary detection modes, including the phase contrast channel (PCC) and normal illumination (NI), detect unique defect types for bare wafers, smooth and rough films, and fragile resists and litho stacks. Image based defect classification (IBC) using revolutionary machine learning algorithms support faster time to root cause, while the Z7^™ classification engine supports unique 3D NAND and thick film applications.

Surfscan^® SP Ax

Unpatterned Wafer Defect Inspection System

The Surfscan^® SP A2 and Surfscan^® SP A3 unpatterned wafer inspection systems identify defects and wafer surface quality issues that affect the performance and reliability of chips manufactured for the automotive, IoT, 5G, consumer electronics, and industrial (military, aerospace, medical) applications. These inspection systems support device, OEM, materials and substrate manufacturing by qualifying and monitoring tools, processes and materials. Using a DUV laser and optimized inspection modes, the Surfscan SP Ax systems deliver the sensitivity required to support fabs defect reduction strategies. Standard darkfield and optional brightfield inspection modes run concurrently, enabling capture and classification of yield critical and latent reliability defect types. Built on the industry-leading Surfscan platform, the Surfscan SP A2/A3 inspectors are configurable and flexible to meet the cost and performance targets for a range of applications. They support substrate and device manufacturing based on either silicon or wide bandgap (SiC, GaN, etc.) materials across 150mm, 200mm and 300mm wafer sizes.

eSL10™

e-Beam Patterned Wafer Defect Inspection System

The eSL10™ electron-beam (e-beam) patterned wafer defect inspection system leverages the industry’s highest landing energy and high resolution to capture small physical and high aspect ratio defects, supporting process development and production monitoring for advanced logic, DRAM and 3D NAND devices. With an innovative electron optics design, the eSL10™ produces high beam current density at a small spot size and the industry’s widest range of operating conditions for defect capture across an array of challenging process layers and device structures. Revolutionary Yellowstone™ scanning mode supports high speed operation without compromising resolution, for efficient investigation of suspected hotspots or defect discovery within a broad chip area. Industry-unique Simul-6™ technology provides surface, topographic, material contrast and deep trench information in a single scan, reducing the time required to collect complete information on a variety of defect types. With integrated Artificial Intelligence (AI), the eSL10 employs SMARTs™ deep learning algorithms that discriminate key DOIs from pattern and process noise, enabling capture and classification of critical defects during R&D and ramp.

Click here for more information on the eSL10

eDR7xxx^™

e-Beam Wafer Defect Review and Classification Systems

The eDR7380™ electron-beam (e-beam) wafer defect review and wafer classification system captures high resolution images of defects, producing an accurate representation of the defect population on a wafer. With a wide range of electron optics and a dedicated In-Lens Detector, the eDR7380 supports defect visualization across process steps, including fragile EUV lithography layers, high aspect ratio trench layers and voltage contrast layers. Unique Simul-6™ technology produces a complete DOI pareto in one test for accurate defect sourcing and faster excursion detection. With connectivity features, such as IAS™ for broadband optical patterned wafer inspectors and OptiSens™ for bare wafer inspectors, the eDR7380 provides unique linkage to KLA inspectors for faster yield learning during IC and wafer manufacturing.

eDR^® is a registered trademark of KLA Corporation.