Advanced IC substrates (ICS)
- Fine structure
- High Layer Count
- Large Unit Size
- High alignment accuracy for high I/O density
Direct Imaging for Patterning
KLA’s direct imaging (DI) for patterning systems enable manufacturers to produce advanced PCBs and IC substrates designed with exceedingly thin conductors and transmission lines. These copper traces must be formed with extreme precision as circuit density increases and the distance between lines becomes narrower. KLA’s DI systems establish the required highly accurate and efficient patterning processes by achieving the best imaging results with the highest yield and throughput to support continued innovation for PCBs and IC substrates.
Choose Language:
English
Serena™
Direct Imaging for Advanced IC Substrates (ICS)
The Serena™ direct imaging (DI) system for advanced IC substrates represents a new lithography category, allowing ICS makers to meet the increasing demand for tight alignment and quality fine line design, with the higher efficiency of a flexible digital solution. Serena is the ideal DI solution for substrate applications characterized by large body sizes, high layer counts and fine structures. The Serena system employs KLA’s next-gen Large Scan Optics (LSO)™ Technology, combined with a unique in-scan focus system for uniform and stitch-less trace patterns, across non-flat or distorted organic substrate topographies. Advanced registration, scaling mechanisms and platform precision optimize overlay accuracy and pad-to-via alignment, allowing higher I/O density designs. By using the Serena system, ICS manufacturers can maximize yield of highly efficient patterning on large-area, high-layer-count ABF substrates with uneven topography.
Corus™
Fully Automated, Double-Sided Direct Imaging for Advanced HDI and IC Substrates
The Corus™ 8M double-sided direct imaging (DI) system is fully automated and capable of replacing a complete DI line. Designed for advanced high-density interconnect (HDI) including modified semi-additive processes (mSAP) and IC substrate mass production, this integrated system enables super-fine, highly uniform lines with outstanding accuracy, creating new opportunities for manufacturers and designers. The Corus leverages new and field-proven technologies, including Double-Sided Imaging (DSI)™, Large Scan Optics (LSO)™ and MultiWave Laser™ technologies, for exceptionally high capacity and yield with reduced total cost of ownership. As a fully integrated solution, it is compact, closed and clean, guaranteeing cutting-edge performance and eco-friendly manufacturing.
Advanced high-density interconnect (HDI) including advanced mSAP (modified semi-additive process), IC substrates (ICS)
Corus™️️️️ 8M
A fully automated direct imaging solution for patterning fine lines down to 8µm.
Corus™️️️️ 15M
A fully automated direct imaging solution for patterning fine lines down to 15µm.
Orbotech Infinitum™
Roll-to-Roll Direct Imaging for Flex PCBs
The Orbotech Infinitum™ 10/10XT roll-to-roll direct imaging system is designed for mass production of flex PCBs. Driven by KLA’s Drum Direct Imaging (DDI)™ technology, the Orbotech Infinitum 10/10XT system enables optimal material handling and high-speed imaging with extremely high yield and throughput. The system leverages KLA’s field-proven Large Scan Optics (LSO)™ and MultiWave Laser™ technologies to provide superior line quality with high accuracy and uniformity for even the most delicate flex materials. As an all-in-one, compact and closed solution, it ensures superior performance and optimal efficiency.
Flex PCBs
Orbotech Nuvogo™ Fine
Fine Line, Mass Production Direct Imaging
The Orbotech Nuvogo™ Fine 10 direct imaging (DI) system offers fine resolution patterning with high imaging quality and high throughput for the advanced high-density interconnect (HDI) and flex PCB market. The systems incorporate KLA’s field-proven Large Scan Optics (LSO)™ technology to deliver high depth-of-focus (DOF) and imaging quality, as well as MultiWave Laser™ technology for better uniformity and flexibility to work with a wider range of resists. The Orbotech Nuvogo Fine systems use advanced software infrastructure to enable a wide range of advanced registration targets support and superior scaling. In addition, with a dual table mechanism and outstanding target acquisition speed, these systems ensure high productivity and efficiency.
High-density interconnect (HDI), Flex PCBs, Advanced mSAP (modified semi-additive process)
Orbotech Nuvogo™
Mass Production Direct Imaging
The Orbotech Nuvogo™ series of direct imaging (DI) systems is designed for mass production with the capability to image fine-line structures on nearly every resist type, delivering maximum flexibility to PCB makers. Using KLA’s field-proven Large Scan Optics (LSO)™ technology, these systems provide high imaging quality and high throughput for applications such as high-density interconnect (HDI), flex and advanced multi-layer boards (MLB).
High-density interconnect (HDI), flex and advanced multi-layer board (MLB) PCBs
| Product | Minimum feature size | Registration accuracy FtG (feature to grid) | Laser wavelength | XL model option (up to 25”x32” imaging size) |
|---|---|---|---|---|
| Orbotech Nuvogo 50F | 15µm | ±10µm | 405nm | Yes |
| Orbotech Nuvogo 80F | 15µm | ±10µm | 375nm + 405nm | Yes |
| Orbotech Nuvogo 700 | 18µm | ±10µm | 405nm | Yes |
| Orbotech Nuvogo 800 | 18µm | ±10µm | 375nm + 405nm | Yes |
| Orbotech Nuvogo 750 | 24µm | ±12µm | 405nm | Yes |
| Orbotech Nuvogo 780 | 24µm | ±12µm | 375nm + 405nm | Yes |
Are you sure?
You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.
Would you like to visit KLA China instead?
您已选择查看由Google翻译翻译的此网站。
KLA中国的内容与英文网站相同并改进了翻译。
你想访问KLA中国吗？
If you are a current KLA Employee, please apply through the KLA Intranet on My Access.