IC Component Inspection and Metrology
KLA’s packaged component inspection and metrology systems characterize key features of advanced and traditional package types with varying size and interconnect styles. Our systems provide sensitivity to a variety of defect types as well as accurate and repeatable 3D metrology measurements, which together provide packaging manufacturers the data required to improve their yield while effectively sorting components so that defective parts are quickly removed. By providing flexible systems capable of handling a large variety of package types, engineers can further increase overall operational effectiveness in a dynamic manufacturing environment.
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ICOS™ T3/T7
Packaged IC Inspection and Metrology Systems
The ICOS™ T3/T7 Series delivers multiple options for fully automated optical inspection of packaged integrated circuit (IC) components with tray (T3) or tape (T7) output. The ICOS T3/T7 Series provides increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of issues that affect final package quality. For the most accurate component sorting process, the ICOS T3/T7 Series utilizes Artificial Intelligence (AI) systems with deep learning algorithms to enable smart and agile binning of defect types. The ICOS T3 and T7 inspectors share a common platform, enabling reconfiguration from tray to tape output for optimal tool use in a changing environment.
Component Outgoing Quality Control (OQC) for all package types (Thin Quad Flat Package (TQFP), Quad Flat Package (QFP), BGA, Chip Scale Package (CSP), Wafer-Level Package (WLP), QFN, Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…)
ICOS T345 / T745
Packaged IC component inspection and metrology system with high throughput for mainstream QFP, BGA and QFN packages.
ICOS T385 / T785
Packaged IC component inspection and metrology system with high resolution and high throughput for mainstream QFP, BGA and QFN packages with extended device size range.
ICOS T390XP / T790XP
Packaged IC component inspection and metrology system with extended capability for high end BGA (mobile, SiP, server, AI) packages with extended device size range.
ICOS™ T890XP
Packaged IC and Singulated Substrate Inspection and Metrology Systems
The ICOS™ T890XP component inspector provides high-performance, fully automated optical inspection of packaged integrated circuit (IC) components and singulated IC substrates. The system provides accurate and repeatable 3D metrology and high sensitivity advanced visual inspection (AVI) for 6-sided defect detection to determine final package quality for a wide range of device types and sizes. The ICOS T890XP offers parallel operation of four independent inspection stations and a component sorting station, achieving high throughput, cost-effective component inspection.
Advanced packaging, IC substrates (ICS)
Component Outgoing Quality Control (OQC) for all package types (Thin Quad Flat Package (TQFP), Quad Flat Package (QFP), BGA, Chip Scale Package (CSP), Wafer-Level Package (WLP), QFN, Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…) and singulated IC substrates
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