UV Laser Drilling
KLA's UV laser drilling systems deliver advanced UV drilling performance for challenging IC substrate, flex printed circuits and assembly applications. The systems enable manufacturers to achieve continuously high-quality, high-accuracy, high-throughput drilling of even the smallest vias. Supporting a wide variety of drilling applications, including blind vias (BV), through hole vias (THV) and routing, our UV laser drilling systems provide superior production processing for improved quality and yield.
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Orbotech Apeiron™
UV Laser Drilling for Flex PCBs
The Orbotech Apeiron™ 800 series of UV laser drilling systems provides best-in-class, high-speed UV laser drilling for roll-to-roll (R2R) and sheet-by-sheet panel manufacturing of flexible printed circuits. Leveraging two new technologies–Roll Inside™ and Continuous Beam Uniformity (CBU)™–as well as its field-proven Multi-Path™ technology, the systems enable manufacturers to achieve continuously high-quality, high-accuracy drilling of vias with registration accuracy down to ±12μm and maximum throughput. The Orbotech Apeiron series is designed for a wide variety of drilling applications, including blind vias (BV), through-hole vias (THV) and routing.
Flexible PCBs, Roll-to-roll panels, Sheet-by-sheet panels, Blind vias, Through-hole vias, Routing
Orbotech Apeiron 800XT
High speed UV laser drilling with 4 drilling channels and Roll Inside technology for flex roll drilling up to 520mm wide.
Orbotech Apeiron 800SBS
High speed UV laser drilling with 4 drilling channels for flex sheet panel drilling.
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