Chemistry Process Control

KLA’s chemistry process control products support multiple applications for advanced packaging manufacturing, including analysis and monitoring of wet chemicals used in wafer-level packaging (WLP), panel-level packaging (PLP), and IC substrates. From analysis systems for development of packaging technologies to turn-key solutions for fully automated online chemical monitoring, our products help engineers control advanced packaging processes. The information produced by our chemistry process control systems allows packaging manufacturers to quickly optimize processes and achieve higher yield and reliability.

ECI

Chemistry Process Monitoring

ECI Technology provides chemistry process monitoring products that support advanced packaging manufacturing, including:

Products that support analysis and monitoring of wafer-level packaging (WLP) processes, including through silicon via (TSV), bumping, re-distribution layer (RDL), copper pillar, and under bump metallization (UBM) processes: https://www.ecitechnology.com/products/semiconductor/tsv-wafer-level-packaging/
Products that support panel and IC substrate packaging technologies, including desmear, PTH, e-less or electroplating copper, and final finish processes: https://www.ecitechnology.com/products/semiconductor/ic-substrate-panel-packaging/

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