![](https://images.sproutvideo.com/26451318602aaf05812532f3e906e8f5/986b23dcb4e7463b1df245fe21e795c3/poster_frames/frame_0000.jpg)
Sigma® fxP – Metal Deposition for Power Devices
Jun 15, 2021Talking Poster (with captions) – Introduction to physical vapor deposition (PVD) of metal layers for power devices. The processes include thick Al deposition to the frontside of the wafer where SPTS’s Sigma® fxP system can deposit thick films with a high deposition rate to increase productivity, but without the film defects normally associated with high rate deposition. For depositing metals on the back side of the power device wafer, a stack of different metals are required. For back side metal deposition, effective low damage pre-clean and stress control are paramount.