As semiconductor and PCB structures trend smaller and smaller, the definition of circuit patterns on substrates must be much more precise. This requires a new way of approaching direct imaging lithography technology – which may seem daunting to many, but KLA’s product engineering teams live for solving complex challenges. Discover how KLA’s experts are developing complex systems with high-powered lasers, sophisticated optics and advanced algorithms to overcome technical challenges for patterning and push the boundaries of what’s possible for advanced packaging.