
Looking Ahead with Direct Imaging
Jan 20, 2025Share This Page
As semiconductor and PCB structures trend smaller and smaller, the definition of circuit patterns on substrates must be much more precise. This requires a new way of approaching direct imaging lithography technology – which may seem daunting to many, but KLA’s product engineering teams live for solving complex challenges. Discover how KLA’s experts are developing complex systems with high-powered lasers, sophisticated optics and advanced algorithms to overcome technical challenges for patterning and push the boundaries of what’s possible for advanced packaging.