Axion® T2000: X-Ray Vision for Vertical Memory Devices
Dec 6, 2022
KLA’s new Axion® T2000 metrology system harnesses the power of X-rays to measure the complex vertical structures that form advanced memory chips....
Teron™ SL670e and Teron™ SL670e XP: EUV Reticle Quality Control
Apr 12, 2022
Extreme ultraviolet (EUV) lithography is a key technology inflection for the semiconductor industry. While shifting the scanner wavelength to EUV...
KLA’s Frontline Cloud Services Sharply Reduces DFM Analysis Time
Apr 7, 2022
Imagine if manufacturers could reduce design-for-manufacturability (DFM) analysis time by 96% and, ultimately, the time to market for complex PCBs....
Rougher Surfaces, Steeper Slopes – Navigating the High Performance Capability of the New Generation Filmetrics® Profilm3D®
Jan 25, 2022
The KLA Instruments™ portfolio of optical profiler tools are widely used in the industry due to their rapid measurement time...
Voyager® 1035: A Unique Combination of Deep Learning, Speed and Sensitivity
Sep 21, 2021
Chip manufacturing is a journey of a thousand process steps. Each step requires extreme precision and control in order to...
New Automotive Solutions Ensure High Quality, High Reliability, High Yield
Jun 22, 2021
KLA is committed to helping the automotive industry achieve strict electronics quality standards. To this end, we’ve unveiled four new...
Orbotech’s Frontline Accelerates Time to Market
Mar 16, 2021
Today’s PCB (printed circuit board) engineering departments face many challenges in their process planning, including long and complex planning cycles,...
PWG5™: The Complete Wafer Geometry System for IC Fabs
Dec 8, 2020
3D NAND memory is pervasive in today’s electronics – mobile devices, laptops, data centers, automobiles, and USB drives are just...
Surfscan® SP7XP: Detecting Defects Drives Pristine Processes
Dec 7, 2020
Today, KLA Corporation announced our new Surfscan® SP7XP wafer defect inspection system. This new member of our Surfscan family of...