![](https://images.sproutvideo.com/26451318602aaf05812532f3e906e8f5/93b8db04b34763d536222b35c6cedb0d/poster_frames/frame_1691702621.jpg)
Advanced Packaging Webinar Series (Part III) – PVD Processes for UBM/RDL
Nov 10, 2021In the third and final part of our webinar series on the various wafer level processes that are enabling the implementation of a range of different “advanced” packaging solutions, this 35-40 min presentation will describe recent developments in this market and focus on the challenges and solutions for metal deposition using physical vapor deposition (PVD) in specific applications.